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Introduction

The premier conference on thermal design, management and characterization of electronic components and systems. SEMI-THERM tackles critical thermal issues by: Addressing the entire area of electronics thermal management Providing a venue for dissemination of practical information in a timely fashion Fostering technical networking Providing opportunity for greater vendor- customer communication SEMI-THERM 31 Conference Tracks and Champions Computational Fluid Dynanmics (CFD) Analysis, Guy Wagoner Computational Fluid Dynanmics (CFD) Case Studies, John Parry Thermoelectric and Energy Harvesting, Zaruaki Yazawa System Level and Form Factor Challenges, Bill Maltz Data Centers, Nishi Ahuja Quality and Reliability, Daniel Abishai LEDs, Patrick Bournes Thermal Interface Materials (TIMs), Dave Saums Mobile and Graphics Challenges, Hussameddine Kabbani View SEMI-THERM 31 Advance Program Symposium Highlights: Internationally recognized program committee, speakers and presenters Keynote and special distinguished speakers throughout the symposium Over 55 presented papers from the worldwide thermal community Pre-conference short courses on basic and advanced thermal topics FREE Vendor Workshops with the most recent technical information from suppliers and vendors FREE Exhibition with the highest concentration of thermal related products in the world FREE 'How-To' courses for all engineering disciplines on thermal topics that you can use every day

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Important Date
  • Conference Date

    Mar 15

    2015

    to

    Mar 19

    2015

  • Mar 19 2015

    Registration deadline

Sponsored By
IEEE Components
Packaging and Manufacturing Technology Society
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