Abstract List
My Submissions
222
Thermo-Mechanical Analysis of SiC Schottky-Barrier Diode Press Pack Packaging using Finite Element SimulationFinal Paper

Zhao Wang*, Ke Feng, Xiaofei Yang

Plenary Track > Packaging, power modules, and ICs

208
Power Module with Large Short Term Current Capability by Using Phase Change MaterialFinal Paper

Weihua Shao*, Li Ran, Zheng Zeng, Philip Mawby, Ruizu Wu, Huaping Jiang, Debaprasad Kastha, Prabodh Bajpai

Plenary Track > Packaging, power modules, and ICs

194
WiPDA asia 2018 Oral Biography form and presentation 756188Abstract Pending

Plenary Track > Packaging, power modules, and ICs

    18 Records 2/2
  • 1
  • 2
Important Date

  • Conference Date

    May 17

    2018

    to

    May 19

    2018

  • Dec 08 2017

    Abstract Submission Deadline

  • Jan 30 2018

    Abstract Notification of Acceptance

  • Feb 10 2018

    Draft paper submission deadline

  • Feb 10 2018

    Final Paper Deadline

  • May 19 2018

    Registration deadline

Sponsored By
IEEE
Organized By
Xi'an Jiaotong University
Xidian University
Contact Information
Login to view full contact details
Previous Conferences