IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2018)

Comparative Evaluations and Failure Modes of Wire- Bonding Packaged SiC, Si, and Hybrid Power ModulesAbstract Pending

Xiaoling Li, Zheng Zeng*, Hao Chen, Weihua Shao, Li Ran

Plenary Track > Packaging, power modules, and ICs

testAbstract Pending

Plenary Track > Packaging, power modules, and ICs

Industrial Robotic Claw for Cottage IndustriesAbstract Pending

Mursal Furqan*, Mahaveer Rathi

Plenary Track > Packaging, power modules, and ICs

A Novel Cascode GaN Switch Integrating Paralleled GaN DHEMTs for High-Power ApplicationsFinal Paper

Tianhua ZHU*, Fang ZHUO, Feng WANG, Hailin WANG, Xinlu HE, shuhuai SHI

Plenary Track > Packaging, power modules, and ICs

A SiC MOSFET based High-voltage Series-connected DevicesFinal Paper

xijun ni*

Plenary Track > Packaging, power modules, and ICs

A 2.6GHz Class-AB GaN Power Amplifier with Maximum Output Power of 56W Achieving 70% Power Added EfficiencyFinal Paper

Zeqiang Chen, Ken Li, Kai Jin, Chenxi Huang, Peng Li, Li Geng*

Plenary Track > Packaging, power modules, and ICs

High Efficiency Quasi Class-J GaN PA with 1.8-3.0GHz BandwidthFinal Paper

Chenxi Huang, Zeqiang Chen, Li Geng*, Qin Xia, Peng Li

Plenary Track > Packaging, power modules, and ICs

Vibrational Energy Harvesting System with MPPT for IoT ApplicationsFinal Paper

wei gou, shiquan fan*, li geng

Plenary Track > Packaging, power modules, and ICs

A Phase-Leg Full SiC Power Module Used in Vienna RectifiersFinal Paper

cheng zhao, Wang Laili*

Plenary Track > Packaging, power modules, and ICs

A Novel Packaging Method Using Flexible Printed Circuit Board for High-Frequency SiC Power ModuleFinal Paper

Yang Fengtao, Wang Laili*, Cheng Zhao, Qi Zhiyuan, Wang Jianpeng, Chen Yang, Zhang Yang

Plenary Track > Packaging, power modules, and ICs

Gate drive Design for a Hybrid Si IGBT/SiC MOSFET ModuleFinal Paper

Puqi Ning*, Lei Li

Plenary Track > Packaging, power modules, and ICs

Novel Silicon Carbide Integrated Power Module for EV applicationFinal Paper

Bassem Mouawad*, Jordi Espina, Jianfeng Li, Lee Empringham, christopher Johnson

Plenary Track > Packaging, power modules, and ICs

The Thin Plate Heat Pipe Koch Fractal Wick Structures InvestigationFinal Paper

Jun Liu, Zhenyu Wang*, Binbin Jiao, Yunqian Song, Rong Gao, Quan Hu

Plenary Track > Packaging, power modules, and ICs

Optical Coherence Tomography-Based IGBT Non-Destructive TestingFinal Paper

ZHIYI ZHAO*, Yihua Hu, Yaochun Shen, Chengmin Li, Wuhua Li, Weifeng Hu

Plenary Track > Packaging, power modules, and ICs

Comparative Packaging Evaluation and Failure Mode Analysis of SiC, Si, and Hybrid Power ModulesFinal Paper

Plenary Track > Packaging, power modules, and ICs