Low power CMOS and embedded memory Foundry technology RF process, device and integration technology Standalone memory: DRAM, FLASH, emerging memory technology Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition, etc. Nanopatterning: Multiple patterning, Directed Self-Assembly, EUV, etc. Power and analog IC device and technology Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAA, 2D materials/1D nanowires Material, Process and device modeling TFT and organic electronics MEMS, imagers and sensors Advanced manufacturing technology, metrology and yield Reliability physics, characterization and test Advanced packaging and 2.5D/3D Integration Photonics and Beyond CMOS Technology Energy harvesting technology Wearable and loE enabling technologies Neuromo
Apr 16
2018
Apr 19
2018
Abstract Submission Deadline
Draft paper submission deadline
Final Paper Deadline
Draft Paper Acceptance Notification
Registration deadline
2021-04-19 Taiwan, China Hsinchu
2021 International Symposium on VLSI Technology, Systems and Applications2019-04-22 Taiwan, China Ambassador Hotel Hsinchu
2019 International Symposium on VLSI Technology, Systems and Application
Submit Comment