Introduction

The International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA symposium), first held in 1983, gathers experts from all over the world and has always been fruitful and productive. Every year, scientists and engineers discuss and present the state-of-the-art technology R&D and macro development of the industry’s future. It is considered the most important event in Taiwan’s semiconductor industry and highly anticipated by local companies. Taking advantage of the information learned during the conference, the symposium hopes to create new opportunities for Taiwan’s semiconductor industry. The VLSI-TSA symposium is becoming more significant since Taiwan not only occupies a prominent position in the global semiconductor industry, but also is increasingly competitive globally in IC design technology and communications information products.

The VLSI-TSA symposium is proud to create a platform for enriching technical exchange and networking between experts from all over the world. The purpose is to bring together scientists and engineers actively engaged in research, development, and manufacturing on VLSI Technology, Systems and Applications to discuss the latest progress in this field.

Sponsor Type:1; 1; 9

Committee

Chair: Emily Kuo

Co-chair: Wen-Chi Yang

General Secretariat: Emily Kuo

Secretariat: Caroline Huang

Call for paper

Important date

2021-01-15
Draft paper submission deadline

Submission Topics

The scope of papers requested in 2021 VLSI-TSA includes the following fields : 

•  Low power CMOS and embedded memory
•  Foundry technology
•  RF & THz process, device and integration technology 
•  Standalone memory: DRAM, FLASH, emerging memory technology
•  Advanced process modules
•  Nanopatterning: Multiple patterning, Directed Self-Assembly, EUV, etc.
•  Power and analog IC device and technology  
•  Advanced CMOS process and devices
•  Material, process and device modeling
•  TFT and organic electronics
•  MEMS, imagers and sensors
•  Advanced manufacturing technology, metrology and yield
•  Reliability physics, characterization and test
•  Advanced packaging and 2.5D/3D Integration
•  Photonics and Beyond CMOS Technology
•  Energy harvesting technology
•  Wearable and loE enabling technologies
•  Neuromorphic devices and materials for brain-inspired computing 
•  Quantum phenomena and information technologies
•  Device technologies for AI deep learning applications
•  2D Electronics

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Important Date
  • Conference Date

    Apr 19

    2021

    to

    Apr 22

    2021

  • Jan 15 2021

    Draft paper submission deadline

  • Apr 22 2021

    Registration deadline

Sponsored By
IEEE Electron Devices Society IEEE Solid-State Circuits Society Industrial Technology Research Institute - ITRI
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