Introduction

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 21 is to be held in Yokohama on April 18-20, 2018.

Call for paper

Important date

2018-02-09
Abstract submission deadline
2018-03-16
Draft paper acceptance notification
2018-03-30
Final paper submission deadline

Contributions are solicited in the following areas:

  • Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
  • Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
  • Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.
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Important Date

  • Conference Date

    Apr 18

    2018

    to

    Apr 20

    2018

  • Feb 09 2018

    Abstract Submission Deadline

  • Mar 16 2018

    Draft Paper Acceptance Notification

  • Mar 30 2018

    Final Paper Deadline

  • Apr 20 2018

    Registration deadline

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