Introduction

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 20 is to be held in Yokohama on April 19-21, 2017.

Call for paper

Important date

2017-02-13
Abstract submission deadline
2017-03-08
Abstract notification of acceptance
2017-03-31
Draft paper submission deadline

Submission Topics

  • Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.

  • Novel Architectures and Schemes for Single Core, Multi/Many-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.

  • Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.

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Important Date

  • Conference Date

    Apr 19

    2017

    to

    Apr 21

    2017

  • Feb 13 2017

    Abstract Submission Deadline

  • Mar 08 2017

    Abstract Notification of Acceptance

  • Mar 31 2017

    Draft paper submission deadline

  • Apr 21 2017

    Registration deadline

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