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Introduction

ICICM-International Conference on Integrated Circuits and Microsystemsis an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.
The previous 2 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 and Nanjing on November 8-11, 2017. The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018) will be held on November 24-26, 2018 in Shanghai, China with the support from University of Electronic Science and Technology of China and Southeast University, China.

Call for paper

Important date

2017-07-30
Draft paper submission deadline
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Important Date
  • Conference Date

    Nov 08

    2017

    to

    Nov 11

    2017

  • Jul 30 2017

    Draft paper submission deadline

  • Nov 11 2017

    Registration deadline