2016 IEEE International Conference on Integrated Circuits and Microsystems (ICICM 2016) is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. This conference provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.
2016 IEEE International Conference on Integrated Circuits and Microsystems (ICICM 2016) will be held duing November 23-25, 2016 in Chengdu, China. It is supported by University of Electronic Science and Technology of China.
All accepted papers after proper presentation and registration will be collected in the conference proceedings by IEEE, proceedings will be submitted and reviewed by the IEEE Xplore and Ei Compendexafter the conference.
The conference is soliciting state-of-the-art research papers in the following areas of interest:
Silicon integrated circuits and manufacturing
Digital, Analog, Mixed Signal IC and SOC design technology
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Reliability
Modeling and simulation
Packaging and testing technology
Equipment technology
Solar cell & other devices for new energy sources
Nov 23
2016
Nov 25
2016
Abstract Submission Deadline
Draft paper submission deadline
Final Paper Deadline
Registration deadline
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