Introduction

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications.

Sponsor Type:1; 1; 9

Committee

General Co-Chairs

Sherief Reda, Brown Univ.
Yiran Chen, Duke Univ.

Technical Program Co-Chairs

Hai Li, Duke Univ.
Charles Augustine,Intel

Treasurer

Ajay Joshi,Boston Univ.

Local Arrangements Chair

Ayse K. Coskun, Boston Univ.

Zoom Arrangements

Xiang Che,GMU

Web/Registration Chair

Hiwot Tadese Kassa, UMich

Publications Chair

Fan Chen, IU

Design Contest Co-Chairs

Kapil Dev, Nvidia

Publicity Co-Chairs

Ilaria Scarabottolo, USI

Call for paper

Important date

2021-03-15
Draft paper submission deadline
2021-05-21
Draft paper acceptance notification

Submission Topics

Specific topics include, but are not limited to, the following three main tracks and sub-areas:

1. Technology, Circuits, and Architecture

1.1. Technologies

Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical,
printable, biomedical, battery, and alternative energy storage devices.

1.2. Circuits

Low-power digital circuits for logic, memory, reliability, clocking, power gating, resiliency, near-threshold and subthreshold, variability, and digital assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging, DC-DC converters, and analog assist schemes.

1.3. Logic and Architecture

Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics and other special purpose cores), cache, memory, arithmetic/Signal processing, cryptography, variability, asynchronous design, and nonconventional computing.

2. CAD, Systems, and Software

2.1. CAD Tools and Methodologies

CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.

2.2. Systems and Platforms

Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and systemlevel power implications due to reliability and variability.

2.3. Software and Applications

Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.

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Important Date
  • Conference Date

    Jul 26

    2021

    to

    Jul 28

    2021

  • Mar 15 2021

    Draft paper submission deadline

  • May 21 2021

    Draft Paper Acceptance Notification

  • Jul 28 2021

    Registration deadline

Sponsored By
Association for Computing Machinery Special Interest Group on Design Automation - ACM SIGDA IEEE Circuits and Systems Society IEEE Council on Electronic Design Automation