The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications.
Sponsor Type:1; 1; 9
General Co-Chairs
Sherief Reda, Brown Univ.
Yiran Chen, Duke Univ.
Technical Program Co-Chairs
Hai Li, Duke Univ.
Charles Augustine,Intel
Treasurer
Ajay Joshi,Boston Univ.
Local Arrangements Chair
Ayse K. Coskun, Boston Univ.
Zoom Arrangements
Xiang Che,GMU
Web/Registration Chair
Hiwot Tadese Kassa, UMich
Publications Chair
Fan Chen, IU
Design Contest Co-Chairs
Kapil Dev, Nvidia
Publicity Co-Chairs
Ilaria Scarabottolo, USI
Specific topics include, but are not limited to, the following three main tracks and sub-areas:
1. Technology, Circuits, and Architecture
1.1. Technologies
Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical,
printable, biomedical, battery, and alternative energy storage devices.
1.2. Circuits
Low-power digital circuits for logic, memory, reliability, clocking, power gating, resiliency, near-threshold and subthreshold, variability, and digital assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging, DC-DC converters, and analog assist schemes.
1.3. Logic and Architecture
Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics and other special purpose cores), cache, memory, arithmetic/Signal processing, cryptography, variability, asynchronous design, and nonconventional computing.
2. CAD, Systems, and Software
2.1. CAD Tools and Methodologies
CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.
2.2. Systems and Platforms
Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and systemlevel power implications due to reliability and variability.
2.3. Software and Applications
Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.
Jul 26
2021
Jul 28
2021
Draft paper submission deadline
Draft Paper Acceptance Notification
Registration deadline
2023-08-07 Austria Vienna
2023 IEEE/ACM International Symposium on Low Power Electronics and Design2022-08-01 United States Boston
2022 IEEE/ACM International Symposium on Low Power Electronics and Design2018-07-23 United States
2018 IEEE/ACM International Symposium on Low Power Electronics and Design2017-07-24 Taiwan, China Taipei
2017 IEEE/ACM International Symposium on Low Power Electronics and Design2016-08-08 United States San Francisco,USA
International Symposium on Low Power Electronics and Design2015-07-22 Italy
2015 IEEE/ACM International Symposium on Low Power Electronics and Design2014-08-11 United States
International Symposium on Low Power Electronics and Design
Submit Comment