Introduction

Pending sponsorship by the ACM Special Interest Group on Design Automation (SIGDA), the IEEE Circuits and Systems Society (CASS) and the IEEE Council on Electronic Design Automation (CEDA). The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design, and optimization, to system software and applications.

Committee

Organizing Committee

General Co-Chairs

  • Helen Li, Duke University

  • Charles Augustine, Intel

Technical Program Co-Chairs

  • Ayse Kivilcim Coskun, Boston University

  • Swaroop Ghosh, Penn State University

Treasurer

  • Weichen Liu

Local Arrangements Chair

  • Ayse Kivilcim Coskun, Boston University

Zoom Arrangements

  • Xiang Chen, GMU

Web/Registration Chair

  • Hiwot Tadese Kassa, UMich

Publications Chair

  • Fan Chen, IU

Design Contest Co-Chairs

  • Kapil Dev, Nvidia

  • Marco Donato, Tufts University

Publicity Chair

  • Linghao Song, UCLA

Call for paper

Important date

2022-03-11
Abstract submission deadline
2022-03-18
Draft paper submission deadline
2022-05-23
Draft paper acceptance notification

Submission Topics

1. Technology, Circuits, and Architecture

1.1. Technologies

Low-power technologies for device, interconnect, logic, memory, 2.5/3D, cooling, harvesting, sensors, optical, printable, biomedical, battery, and alternative energy storage devices and technology enablers for non-Boolean and quantum/quantum-inspired compute models.

1.2. Circuits

Low-power circuits for logic, memory, reliability, clocking, resiliency, near-/sub-threshold, and assist schemes; Low-power analog/mixed-signal circuits for wireless, RF, MEMS, AD/DA Converters, I/O, PLLs/DLLS, imaging and DC-DC converters; Energy-efficient circuits for emerging applications (e.g., biomedical, in-vitro sensing, autonomous), circuits using emerging technologies; Cryogenic circuits.

1.3. Logic and Architecture Low-power logic and microarchitecture for SoC designs, processor cores (compute, graphics, and other special purpose cores), cache, memory, arithmetic/signal processing, cryptography, variability, asynchronous design, and non-conventional computing.

2. EDA, Systems, and Software

2.1. CAD Tools and Methodologies

CAD tools and methodologies for low-power and thermalaware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all levels of design abstraction: physical, circuit, gate, register transfer, behavior, and algorithm.

2.2. Systems and Platforms Low-power, power-aware, and thermal-aware system design including data-center power delivery and cooling, Platforms for SoCs, embedded systems, approximate and brain-inspired computing, Internet-of-Things (IoT), wearable computing, body-area networks, wireless sensor networks, and system-level power implications due to reliability and variability.

2.3. Software and Applications

Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, power optimizations through HW/SW interactions, and emerging software low-power applications.

3. Crosscutting Themes

3.1. AI/ML Hardware Low-power

AI/ML techniques including approximations, application driven optimizations, in-memory/energy-efficient accelerations, and neuromorphic computing; Efficient AI/ML using emerging technologies (including quantum computing).

3.2. Hardware and System

Security Low-power hardware security primitives (PUF, TRNG, cryptographic/post-quantum cryptographic accelerators), nanoelectronics security, supply chain security, IoT security and AI/ML security; Energy-efficient approaches to system security.

4. Industrial Design Track

SLPED’22 solicits papers for an “Industrial Design” track to reinforce interaction between the academic research community and industry. Industrial Design track papers have the same submission deadline as regular papers and should focus on similar topics, but are expected to provide a complementary perspective to academic research by focusing on challenges, solutions, and lessons learnt while implementing industrial-scale designs.

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Important Date
  • Conference Date

    Aug 01

    2022

    to

    Aug 03

    2022

  • Mar 11 2022

    Abstract Submission Deadline

  • Mar 18 2022

    Draft paper submission deadline

  • May 23 2022

    Draft Paper Acceptance Notification

  • Aug 03 2022

    Registration deadline

Sponsored By
Association for Computing Machinery Special Interest Group on Design Automation - ACM SIGDA
IEEE Circuits and Systems Society
IEEE Council on Electronic Design Automation