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63
A Novel IGBT with Double Buffer Layers for High Temperature OperationFinal Paper

Qian Zhang, Jun Wang*, Gaoqiang Deng, Shiwei Liang, Kai Xiao

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration, and materials

1
投稿测试Draft Accepted

Hengyang Liu*

Power Electronics Technology and Application > Power semiconductor devices, passive components, packaging, integration, and materials

    2 Records 1/1
Important Date

  • Conference Date

    Nov 03

    2022

    to

    Nov 05

    2022

  • Aug 01 2022

    Draft paper submission deadline

  • Nov 04 2022

    Registration deadline

  • Nov 05 2022

    Contribution Submission Deadline

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Huazhong University of Science and Technology
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