2023 IEEE International 3D Systems Integration Conference (3DIC)

AboutBioengineering; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Engineering Profession; Fields, Waves and Electromagnetics; Photonics and Electrooptics; Power, Energy and Industry Applications
Keywords:Pacakging,3D integration,heterogeneous integration,Device Reliability,
Scope:The conference will invite researchers from industry and academia. We would like to have talks and invite papers which show the present state of the art research in 3D integration and also have a session under each section which gives a vision for the future research in that domain. Some of the areas covered in the conference will be Technology Materials Equipment Wafer handling Diverse substrates TSV Alignment Bonding Wafer cleaning Thinning Dicing Chiplets Interposers 3D integration coupling Design and CAD Synthesis Design flows Signal design Power integrity Thermal considerations Mechanical stress Reliability and test Techniques Analysis Applications Imaging Memory Processors Communications Networking Wireless Biomedical Sensors SOC MEMS DSP FPGA RF Microwave Millimeter wave Analog Circuits Biomedical Circuits Photonics
Sponsor Type:1; 9