Introduction

EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems.  Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for:

    • signal integrity & power integrity
    • advanced packaging and heterogeneous integration
    • performance optimization

of systems for high-speed electronics, RF and wireless communication, and quantum computing.

We look forward to seeing you in Toronto!

Committee

Conference chairs

  • Piero TriverioUniversity of Toronto (general chair)
  • Wendem BeyeneMeta (co-chair)

Conference organization

  • Vaishnav Srinivas, Qualcomm (finance chair)
  • Xu Chen, University of Illinois, Urbana (website chair)
  • Paolo Manfredi, Politecnico di Torino (TPC secretary)

Technical program committee

  • Ramachandra Achar, Carleton University
  • Kemal Aygun, Intel
  • Heidi Barnes, Keysight
  • Wendem Beyene, Facebook
  • Xu Chen, University of Illinois, Urbana
  • Chris Cheng, Hewlett-Packard Enterprise
  • Swagato Chakraborty, Siemens
  • Paul Franzon, North Carolina State University
  • Dipanjan Gope, Indian Institute of Science
  • Stefano Grivet-Talocia, Politecnico di Torino
  • Xiaoxiong (Kevin) Gu, Metawave
  • Jose Hejase, Nvidia
  • Roni Khazaka, McGill University
  • Joungho Kim, KAIST
  • Paolo Manfredi, Politecnico di Torino
  • Rajen Murugan, Texas Instruments
  • Vladimir Okhmatovsky, University of Manitoba
  • Zhen Peng, University of Illinois, Urbana
  • Tawfik Rahal-Arabi, AMD
  • Sourajeet Roy, IIT, Roorkee
  • Albert Ruehli, Emeritus IBM; MST
  • Rohit Sharma, IIT, Ropar
  • Vaishnav Srinivas, Qualcomm
  • Junyan Tang, IBM
  • Jai Narayan Tripathi, IIT Jodhpur
  • Piero Triverio, University of Toronto
  • Dries Vande Ginste, Ghent University
  • Andreas Weisshaar, Oregon State University
  • Tzong-Lin Wu, National Taiwan University
  • Ali Yilmaz, University of Texas, Austin

Paper review committee

  • Giulio Antonini, University of L’Aquila
  • CK Cheng, University of California at San Diego
  • Paul Dahlen, IBM
  • Daniel DeAraujo, Siemens
  • Dirk Deschrijver, Ghent University
  • Matt Doyle, IBM
  • Xiaomin Duan, IBM
  • Ege Engin, San Diego State University
  • Francesco Ferranti, Vrije Universiteit Brussel
  • Fei Guo, Marvell Technology
  • Sunil Gupta, Qualcomm
  • Anand Haridass, Intel
  • Shaowu Huang, Marvell
  • Jingook Kim, UNIST
  • Gokul Kumar, Micron
  • Naiguang Lei, Synopsys
  • Bowen Li, Google
  • Tianjian Lu, Google
  • Ivan Maio, Politecnico di Torino
  • Zhen Mu, Cadence
  • Bhyrav Mutnury, Dell
  • Behzad Nouri, Carleton University
  • Andrew Page, IBM
  • Pavel Roy Paladhi, IBM
  • Zhiguo Qian, Intel
  • Sameer Shekhar, Intel
  • Eakhwan Song, Kwangwoon University
  • Jairam Sukumar, Qualcomm
  • Tao Wang, Qualcomm
  • Boping Wu ,Huawei
  • Biancun Xie, Qualcomm
  • Zhuo Yan, Apple
  • Ming Yi, Nvidia
  • Huan Yu, Apple
  • Biyao Zhao, Nvidia
  • Zhen Zhou, Intel

Emeritus advisory board

  • Dale Becker, IBM
  • Henning Braunisch, Intel
  • Jose Schutt-Aine, University of Illinois, Urbana
Call for paper

Important date

1970-01-01 00:00:00
Abstract submission deadline
1970-01-01 00:00:00
Abstract notification of acceptance
2024-05-17 00:00:00
Draft paper submission deadline
1970-01-01 00:00:00
Draft paper acceptance notification

We welcome new and unpublished contributions on:

Interconnects design & technologies

  • High-speed channels, backplanes, SerDes, memory, DDR interfaces
  • Interconnect and transceiver co-design, equalization
  • Signal & power integrity issues
  • Jitter, noise
  • High-frequency interconnects, packages, antennas-in-package
  • Novel/unconventional interconnect technologies

 

Manufacturing and measurement

  • Manufacturing, testing, reliability
  • Measurement techniques

 

Packaging and integration

  • Advanced packaging, 3D integration
  • Heterogeneous integration
  • Design of interconnects and packages
  • Quantum systems: interconnection & packaging aspects

 

Modeling and simulation

  • Modeling, simulation, computer-aided design
  • Thermal, mechanical, multiphysics modeling
  • ML and AI-based approaches to interconnect and packaging problems
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Important Date
  • Conference Date

    Oct 06

    2024

    to

    Oct 09

    2024

  • May 17 2024

    Draft paper submission deadline

  • Oct 09 2024

    Registration deadline

Sponsored By
IEEE Antennas and Propagation Society
IEEE Electronics Packaging Society
IEEE Microwave Theory and Technology Society