第27届电子封装技术国际会议 (ICEPT 2026)

Advanced Packaging: 2.5D/3D packaging, chiplet integration, wafer-level/board-level fan-out/in packaging, flip-chip packaging, system-level integration, and other heterogeneous/hybrid integration packaging technologies.
Packaging Materials & Processes: Packaging materials, high-end packaging substrate technologies, green/nanomaterial-based packaging materials, and other packaging/assembly-related materials.
Packaging Design & Modeling: Design, modeling, algorithms, and simulation techniques for complex packages; multi-scale and multi-physics modeling, algorithms, and simulation; process simulation techniques.
Interconnect Technologies: Through-Silicon Vias (TSVs), Through-Glass Vias (TGVs), bumps and micro-copper pillars, high-density interconnects, hybrid bonding, vertical power delivery, nanomaterial bonding, chip-to-wafer/panel and wafer-to-wafer interconnects, thermocompression bonding, and other emerging interconnect technologies.
Advanced Manufacturing: Packaging, assembly, and test equipment driven by advanced packaging processes; novel principle-based equipment; key components and modules.
Quality & Reliability: Packaging test technologies, novel reliability testing methods, reliability assessment methodologies, reliability data acquisition and analysis, reliability simulation, lifetime prediction, failure analysis, and non-destructive inspection.
Power & Energy Electronics: Interconnects, thermal management, and substrate technologies for power electronics packaging; wide- and ultra-wide-bandgap semiconductor packaging; hybrid packaging of IGBT, SiC, and GaN; high-voltage packaging; high-junction-temperature packaging; multifunctional integrated packaging; other power semiconductor packaging technologies; packaging and integration of power modules (e.g., switches, isolated/non-isolated power supplies, inverters, IPMs, POLs, PSiPs); power module control algorithms; EMI modeling and optimization; industrial and automotive power modules and systems; other new energy and novel power electronic modules.
Optoelectronics & Display Technologies: Design, simulation, interconnection, and packaging technologies for opto-electronic integration in displays, communications, sensing, and lasers.
RF Packaging: RF IC-package co-design, RF package and module design, RF heterogeneous integration processes, RF passive devices and integration, RF device/system thermal management, RF packaging reliability, mmWave/THz frontiers, antenna-in-package, RF noise suppression in packaging, SAW/BAW resonators, filters, and related technologies.
Emerging Application Packaging: Packaging technologies for high-compute chips enabling bandwidth and scale enhancement; integrated power delivery for high-compute chips; efficient thermal management for high-compute chips; RF-integrated module technologies; MEMS/NEMS packaging; sensor packaging; implantable device packaging; microfluidic 3D printing packaging; self-alignment and assembly technologies; wafer-/board-level packaging for MEMS/sensors; wearable/flexible/bio-electronic packaging.
AI-Enabled Advanced Packaging: AI/ML-driven design, surrogate modeling, and co-optimization; applications of ML/DL in quality control, process optimization, reliability prediction, and failure analysis; generative AI; digital twins; AI-assisted chip-package-system co-design and integration. Advanced packaging architectures and technologies for high-performance AI (heterogeneous integration, 2.5D/3D, chiplets); power delivery, signal integrity, and thermal management for AI systems; system-level solutions.