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Important Date

  • Conference Date

    Aug 05

    2026

    to

    Aug 07

    2026

  • Mar 20 2026

    Abstract Submission Deadline

  • May 20 2026

    Final Paper Deadline

  • May 20 2026

    Contribution Submission Deadline

Sponsored By
Institute of Microelectronics of Chinese Academy of Sciences
Xi'an Jiaotong University
IEEE Electronics Packaging Society (IEEE-EPS)
Electronics Manufacturing and Packaging Technology Branch of the Chinese Institute of Electronics (CIE-EMPT)
Organized By
School of Microelectronics at Xi'an Jiaotong University
Advanced Semiconductor Packaging Center Co., Ltd.
Shaanxi Provincial Semiconductor Industry Association
Beijing Hengren Zhixin Consulting Co., Ltd.
Contact Information
  • 尹雯
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