2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

DTIP 2013 will be a follow-up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu-La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France, in 2009 in Rome, Italy, in 2010 in Seville, Spain in Aix-en-Provence, France in 2011 and in Cannes, Côte d'Azur, France in 2012. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. 72 submissions were received from 17 countries. The symposium will be held in Barcelona, Spain, 16-18 April 2013, includes 2 conferences – CAD, design and test / Microfabrication, integration and packaging -, 2 invited talks and 2 special sessions. The symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP. The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP. We look forward to welcoming you to Barcelona, Spain and encourage you to participate by submitting an abstract for one of the two Conferences.