2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

DTIP 2014 will be a follow-up to the very successful issues held in Paris (1999, 2000), Mandelieu La Napoule (2001 to 2003), Montreux (2004, 2005), Stresa (2006, 2007), Nice (2008), Rome (2009), Seville (2010), Aix-en-Provence (2011), Cannes (2012) and Barcelona (2013). This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.