Introduction
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an open forum for the presentation of the latest results and trends in process and device simulation. The conference is the leading forum for Technology Computer-Aided Design (TCAD) and is held annually.
The 18th edition of the conference will be held on September 3-5, 2013.
Call for paper
Submission Topics
The scope of the conference includes:
Simulation and modelling based on continuum, particle or quantum transport methods for electronic devices including FinFETs, ultra-thin SOI, optoelectronics devices, lasers, TFTs, spintronics devices, carbon nanotube
All Comments
Important Date
-
Conference Date
Sep 03
2013
toSep 05
2013
-
Sep 05 2013
Registration deadline
Sponsored By
IEEE Electron Devices Society
Contact Information
Previous Conferences
-
2017-09-07 Japan Kamakura,Japan
2017 International Conference on Simulation of Semiconductor Processes and Devices -
2016-09-06 Germany Nuremberg, Germany
2016 International Conference on Simulation of Semiconductor Processes and Devices
Submit Comment