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Introduction
ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling/simulation, and applications.
Call for paper

Submission Topics

Sessions and Keywords: 1. Advanced Packaging Wafer Level Packaging, System Integration, PoP, MCM, System on Package, Novel Assembly Technologies 2. Substrate and Interposers Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circu
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Important Date

  • Conference Date

    Apr 23

    2014

    to

    Apr 25

    2014

  • Apr 25 2014

    Registration deadline

Sponsored By
Japan Institute of Electronics Packaging
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