2017 International Conference on Electronics Packaging (ICEP)

1. Advanced Packaging
Wafer Level Packaging, System Integration, PoP, MCM, System on Package, Novel Assembly Technologies 

2. Substrate and Interposers 
Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE

3. Interconnection
Bump Formation, Chip-Package Interaction, Low k, Leadframe, Test of First- and Second- Level Interconnections, Interconnections for 3D Integration, Interconnections in Substrates, PCBs and Systems

4. 3DIC Packaging
TSV, Via Formation and Filling, 2.5D, Wafer Thining, Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, Wide Bus, Wireless Interconnection, Temporary Bonding/De-Bonding

5. Design, Modeling, and Reliability
Signal and Power Integrity, High Speed Board Design, Mechanical Design and Reliability, Failure Analysis, Fracture and Warpage in Packages, Testing, Evaluation, TCAD, 3DIC Design

6. Thermal Management
Advanced Cooling Modules, Heat Pipes, Heat Sinks, Fans and Blowers, Thermal Interface Materials, Thermal Measurements, Micro and Nano Scale Heat Transfer, Thermal Issues in Devices

7. Materials and Process
Novel Materials and Processing, Dielectrics, Emerging Materials and Processes for 3D, Thin Films, Underfills, Assembly Challenges and Solutions, Wefer Thinning, Plating, Equipment, Encapsulation

8. Printed Electronics
Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFTs, Device Applications

9. N-MEMS
NEMS-MEMS/Sensor Devices, MOEMS, Assembly and Packaging, Nano Technology, Nano Imprint Lithography, Organic Semiconductors, Wireless Sensor Networks

10. Optoelectronics
Active Optical Cable, Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards

11. Self-Organization/Self-Assembly
Biomimetics, Nature-Guided, Bottom-up Manufacturing, Smart Materials and Devices, Spontaneous Ordering/Patterning/Structuring, Self-Bonding/Debonding, Repairable, Self-Healing, Novel Micro/Nano Processing

12. Medical Devices
Invasive, Low Invasive, Non Invasive, In Vitro, BAN, Cure, Treatment, Diagnosis, Screening, POC, Healthcare

13. Power Electronics Integration
Si, SiC or GaN Power Device/Module Packaging; Packaging of High-temperature Power Electronics, Sensors; Inverters/Converters for Electric Vehicles; Magnetic Materials and Components; Substrate Technologies; Encapsulation Materials; PE Integration by 3D Printing

14. RF
RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas, Wireless Power Transmission 

15. Others
Market Trends, Environmentally Conscious Products and Processes, Cost Analyses