Introduction

The 20th Annual Pan Pacific Microelectronics Symposium that took place February 2-5, 2015, at the Sheraton Kauai Resort on Kauai, Hawaii was well received by attendees from North America, Asia, and Europe. Over fifty papers were presented to attendees from fourteen countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

As selected by the Technical Committee, the Best Paper Award went to Binghamton University for their paper titled "Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints" presented by Peter Borgesen, Ph.D.

Technical papers from all sessions are featured in the 2015 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.

"2015 marked the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA," noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation.

Call for paper

We solicit your submissions in any topical area including the following:

  1. 3D/Heterogeneous Integration
  2. Build Up/Blind & Buried Via PWBs
  3. Cu Pillars & Posts
  4. MCM/SiP Advances
  5. Module Stacking Origami Flex Packages
  6. Package on Package (PoP) Shaped Circuits
  7. Thru Si Vias (TSV)
  8. Emerging Technologies
  9. Advanced Connectors
  10. Embedded Assembly (Passive & Active)
  11. Interposer Technologies (Si, Glass, etc.)
  12. Thermal Management
  13. Printed Electronics
  14. Wearable Electronics
  15. Structural Electronics
  16. Green Electronics
  17. Environmental Impact Analysis
  18. Green Manufacturing (Pb/Halogen-free, etc.)
  19. Large Area/Module Assembly
  20. Photovoltaics
  21. Power Control/Conversion/Distribution
  22. Power Packaging
  23. Solar Thermal Conversion
  24. High Performance Low I/O
  25. Chip on Glass (CoG)
  26. Compact Florescent Systems
  27. Display Drivers
  28. Flat Panel Processes
  29. LED Packaging & Assembly
  30. Lighting & Displays OLED Developments
  31. MEMS/MOEMS
  32. Material Advances
  33. Connections (Adhesives, Solders, etc.)
  34. Integrated Passive Devices
  35. Interconnect Taxonomy
  36. Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
  37. Phosphors & Light Absorption
  38. Thermal Interface Materials (TIMs)
  39. Thin & Thick Film Systems
  40. Strategic Direction/ Industry Roadmaps
  41. Economics & Cost Analysis
  42. Health & Prognostics
  43. Manufacturing Management & Control
  44. Penetration Strategies
  45. Supply Chain & Operations Management
  46. Technology Drivers
  47. Trends, Forecasts & Roadmaps
  48. Reliability, Health/Prognostics
  49. Failure Analysis
  50. Quality Assessment
  51. Reliability Physics
  52. Test & Measurement
  53. Yield Projection
  54. Nanotechnology
  55. Materials
  56. Processes & Handling
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Important Date

  • Conference Date

    Jan 25

    2016

    to

    Jan 28

    2016

  • Jan 28 2016

    Registration deadline

Sponsored By
Surface Mount Technology Association (SMTA)
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