The Pan Pac technical committee has finalized the program for the 2017 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Kauai Resort. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on advanced processes, design, embedding and Fan-Out packaging, interposer technology, materials, nanotechnology, quality, reliability, roadmaps and manufacturing strategies. The program for the 2017 Pan Pacific Microelectronics Symposium is finalized and now posted.
3D/Heterogeneous Integration
Emerging Technologies
Green Electronics
High Performance Low I/O
Internet of Things (IoT)
Material Advances
Nanotechnology
Photonics
Reliability and Quality
Trends, Roadmaps, and more
Feb 06
2017
Feb 09
2017
Draft paper submission deadline
Registration deadline
2016-01-25 United States Kamuela, HI, USA
2016 Pan Pacific Microelectronics Symposium
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