Introduction

Aim of the Conference: to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products.

Call for paper

Submission Topics

  • Integrated Systems Design:

  • Integrated Systems Technology:

  • Integrated Systems Testing:

  • SOC, SIP design

  • Multiprocessor systems

  • Embedded systems

  • Wireless systems

  • Network on Chip

  • Analog, Mixed Signal and RF systems

  • MEMS and MOEMS systems

  • Low Voltage and Low Power systems

  • Innovative technologies

  • Synthesis (physical, logic)

  • Simulation, Validation and Verification

  • 3D integration

  • Hardware Security

  • Nanoelectronics

  • Device modeling

  • Material characterization

  • Failure analysis

  • New components

  • Packaging

  • Process technology

  • Reliability issues

  • 3D integration

  • Defect and fault modeling

  • Analog and Mixed Signal testing

  • MEMS/MOEMS testing

  • SOC and SIP testing

  • Delay testing

  • Memory testing

  • Fault Simulation, ATPG

  • DFT, BIST and BISR

  • On-line testing and fault tolerant systems

  • ATE issues

  • Alternative test strategies

  • 3D testing

  • Test and Security Issues

  • FPGA design

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Important Date

  • Conference Date

    Apr 04

    2017

    to

    Apr 06

    2017

  • Apr 06 2017

    Registration deadline

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