2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements. The symposium consists of keynote and invited talks from experts, paper presentations, industry exhibition, tutorials and an informal social setting for networking.