2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

The symposium will include both oral and poster sessions. In addition, a number of prominent experts will be giving keynote lectures and tutorials on areas of emerging interest. The official language is English.

TOPICS

1. 3D-ICs/TSVs/Interposers
2. Testing on 3D-IC and SiP
3. Signal and Thermal Integrity
4. Power Integrity/Power Distribution Networks (PDNs)/Ground Noise
5. Computational Electromagnetics and Multi-physics Methods for SI/PI/TI Analysis
6. Thermal Management Design for 3D-ICs and SiP
7. Design and Modeling for High-speed Channels and Interconnects
8. High speed serial links jitter budgeting
9. Jitter segregation algorithms and tools
10. Time / Frequency Domain Measurement Techniques
11. Power supply induced jitter and transfer functions.
12. Nanoelectronics for 3D-ICs and SiP
13. Active Devices and Circuit Modeling Technologies
14. Electronic Packages, SiP/ SoP
15. IC and Package Level EMC
16. Antennas in Packages (AiP)
17. RF/mm-wave and THz Packages
18. Miniaturized and Embedded Passives
19. Power Electronic Packages
20. Advanced Simulation Tools and CAD
21. Substrate Technology for Packages and PCBs
22. Electrical Design of Flexible Devices and Sensing
23. 2-D Materials for 3D-ICs and SiP
24. 3-D ICs and SiP Reliability
25. Electrical Design for 5G Wireless Communication
26. DDR’s Signal and Power integrity considerations
27. Others