2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chip, package and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chip, package and printed circuit board design and measurements. The symposium consists of keynote and invited talks from experts, paper presentations, industry exhibition, tutorials and an informal social setting for networking.
EDAPS is sponsored by the IEEE Components, Packaging and Manufacturing Technology Society.The location for the 2016 edition has been selected to be in Honolulu, Hawaii, USA
EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop, to be held during December 14-16 in Hawaii. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform. Sheraton, Waikiki, in Honolulu, Hawaii, USA
Located oceanfront on the world’s most famous strip of sand, Waikiki Beach, Sheraton Waikiki mixes groups in the heart of excitement, culture, shopping, dining and entertainment.