2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

May. 29 - Jun 01, 2017

Mercure Bordeaux Centre, Bordeaux · France

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Abstract List

My Submissions

Important Date

Conference Date

May 29

2017

to

Jun 01

2017
Jan 30 2016

Draft Paper Acceptance Notification
Nov 11 2016

Abstract Submission Deadline
Dec 02 2016

Draft paper submission deadline
Mar 31 2017

Final Paper Deadline
Jun 01 2017

Registration deadline

Sponsored By

IEEE Components, Packaging and Manufacturing Technology Society

Contact Information

Pascal Nouet
co******@dtip-mems.org
+33*********

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Previous Conferences

2016-05-30 Hungary Budapest, Hungary
2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
2014-04-01 France
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
2013-04-16 Spain
2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS