IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia 2018)

Leakage Current Analytical Model and Suppression In High Frequency SiC Three-Phase InvertersFinal Paper

Junzhong Xu, Wang Yong*, Jingwen Han, Yaosheng Lu, Houjun Tang

Plenary Track > Common-mode and EMI management

DC-Link Capacitors RMS Current Reduction PWM method Based High Frequency SiC Three-Phase InvertersFinal Paper

Junzhong Xu, Wang Yong*, Yaosheng Lu, Jingwen Han, Houjun Tang

Plenary Track > Applications in renewable energy and storage, transportation, industrial drives, and grid power

Analysis of Breakdown Characteristics of AlGaN/GaN HEMTs with Double Passivation LayersFinal Paper

Kazushige Horio*

Plenary Track > Device characterization and modeling

Enhanced DC and RF Characteristics in E∕D-mode AlGaN∕GaN HEMTs by TiN-based source contact technologyFinal Paper

Ling Yang*

Plenary Track > Device structures and fabrication techniques

A High Performance Isolated High Frequency Converter Based on GaN HEMTFinal Paper

Yueshi Guan*, Yijie Wang, Xihong Hu, Wei Wang, Dianguo Xu

Plenary Track > Hard-switched and soft-switched applications

A Double-sided Cooling 1200V/600A Multichip Half-bridge IGBT Module Using Nano-silver Paste as Die-attaching MaterialFinal Paper

Zheng Wang, YUNHUI MEI*, Wen Liu, Yijing Xie, Shancan Fu, Xin Li, Guo-Quan Lu

#Plenary Track

Common Mode Modeling and Reduction of GaN-based Full-bridge InvertersFinal Paper

Wuji Meng*, Zirui Fu, Fanghua Zhang, Guangdong Dong

Plenary Track > Common-mode and EMI management

high frequency dc dc convertertersAbstract Pending

xiaoyong ren, zhiliang zhang*

#Plenary Track

Automatic V-I Alignment for Switching Characterization of Wide Band Gap Power DevicesFinal Paper

Shan Yin*

Plenary Track > Device characterization and modeling

Vertical GaN MOSFETs with Over 1.6 kV breakdown voltage :A theoretical studyingFinal Paper

yanni Zhang, zhiyu Lin*, dai Yang*, jincheng Zhang

Plenary Track > Device structures and fabrication techniques

WiPDA asia 2018 Oral Biography form and presentation 756188Abstract Pending

Plenary Track > Packaging, power modules, and ICs