Abstract List
My Submissions
222
Thermo-Mechanical Analysis of SiC Schottky-Barrier Diode Press Pack Packaging using Finite Element SimulationFinal Paper

Zhao Wang*, Ke Feng, Xiaofei Yang

Plenary Track > Packaging, power modules, and ICs

221
The Security Protection of SiC MOSFET NPC Tri-level ConverterFinal Paper

Wenjun Wu*, Yuxi Cai, Wenxuan Wang, Dongjie Cui

Plenary Track > Applications in renewable energy and storage, transportation, industrial drives, and grid power

220
Investigation of the Effects of Snubber Capacitors on Turn-on Overvoltage of SiC MOSFETsFinal Paper

Liang Wu, Jun Zhao, Long Xiao, Guozhu Chen*

Plenary Track > Gate drive and other auxiliary circuits

219
A 1MHz Gate Driver for Parallel Connected SiC MOSFETs with Protection CircuitFinal Paper

Xuchao Jiang, Yimeng Zhang*

Plenary Track > Gate drive and other auxiliary circuits

218
A Physics-based Lumped-charge Model for SiC MPS Diode Implemented in PSPICE”Final Paper

Yaoqiang Duan, Xin Li, Yifei Luo*, BinLi Liu, Yingjie Jia

Plenary Track > Device characterization and modeling

217
Influence of Lateral Spreading of Implanted Aluminum Ions on Current-Voltage Characteristics of 6.5 kV 4H-SiC Junction Barrier Schottky DiodesFinal Paper

Liu Zheng*

Plenary Track > Device characterization and modeling

216
Measurement of Carrier Lifetime in 4H-SiC PiN Diodes Employing OCVD Method at Different TemperatureFinal Paper

lei yuan*, Yao Bing

Plenary Track > Device characterization and modeling

215
Analysis of EMI in Motor System Driven by PWM InverterFinal Paper

Feng Niu*

Plenary Track > Common-mode and EMI management

214
Fully recessed-gate normally-off AlGaN/GaN high electron mobility transistors with high breakdown electric fieldFinal Paper

Yun-Long He*

Plenary Track > Device structures and fabrication techniques

213
Adaptive On-Time Control for High Efficiency Switched-Tank ConverterFinal Paper

Yanchao Li, Xiaofeng Lyu, Dong Cao*, Shuai Jiang, Chenhao Nan, Ze Ni

Plenary Track > Hard-switched and soft-switched applications

212
High-Power-Density 400VDC-19VDC LLC Solution with GaN HEMTsFinal Paper

Yajie Qiu*, Juncheng Lu

Plenary Track > Hard-switched and soft-switched applications

211
Composite Modular Power Delivery Architecture for Next-Gen 48V Data Center ApplicationsFinal Paper

Xiaofeng Lyu*, Dong Cao*, Chenhao Nan, Shuai Jiang, Ze Ni, Jalen Johnson, Yanchao Li

Plenary Track > Very high efficiency and compact converters

210
A Single SiC Switch Based ZVZCS Topology for Tapped Inductor Buck ConverterFinal Paper

Jihoon Kim*

Plenary Track > Very high efficiency and compact converters

209
Analysis of Schottky Forward Current Transport Mechanisms in AlGaN/GaN HEMTs over a Wide Temperature RangeFinal Paper

Mei Wu*

Plenary Track > Device characterization and modeling

208
Power Module with Large Short Term Current Capability by Using Phase Change MaterialFinal Paper

Weihua Shao*, Li Ran, Zheng Zeng, Philip Mawby, Ruizu Wu, Huaping Jiang, Debaprasad Kastha, Prabodh Bajpai

Plenary Track > Packaging, power modules, and ICs

Important Date

  • Conference Date

    May 17

    2018

    to

    May 19

    2018

  • Dec 08 2017

    Abstract Submission Deadline

  • Jan 30 2018

    Abstract Notification of Acceptance

  • Feb 10 2018

    Draft paper submission deadline

  • Feb 10 2018

    Final Paper Deadline

  • May 19 2018

    Registration deadline

Sponsored By
IEEE
Organized By
Xi'an Jiaotong University
Xidian University
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