Introduction

This symposium pictures the future state of the electronics packaging which impacts the infrastructures of B5G and 6G. This symposium also tries to predict where the packaging technology is heading. The symposium will emphasize the following main topics: Photonics, Advanced Packaging, Power Electronics, Automotive Electronics and Bioelectronics to discuss about the technologies on Electronics Packaging for Digital Twin.

Call for paper

Important date

2025-05-30
Draft paper submission deadline
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Important Date

  • Conference Date

    Nov 12

    2025

    to

    Nov 14

    2025

  • May 30 2025

    Draft paper submission deadline

  • Nov 14 2025

    Registration deadline

Sponsored By
IEEE Electronics Packaging Society
Organized By
IEEE Electronics Packaging Society
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