Introduction

“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

The age of IoT: The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to "ICSJ" in 2010. Topics include a variety of packaging technologies, ranging from VLSI, 3D packaging, optoelectronics, bio and healthcare. In 2016 the conference will emphasize two main topics: IoT and Power electronics. The Internet of Things (IoT) will make revolutionary changes to the packaging technologies for smarter usage of the devices (sensors, RFIDs, MEMS, wireless components, etc.) in various application fields such as healthcare, Industry 4.0, automotive, and so on. Furthermore, for future automated automotive driving technologies and connected car will be driven by a collaboration of IoT and power electronics. 

Call for paper

Important date

2016-05-27
Abstract submission deadline
2016-09-09
Draft paper submission deadline
2016-07-08
Draft paper acceptance notification

Submission Topics

  • 3D Packaging & Chip on Chip

  • Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP

  • Board-Level Integration

  • Integrated Substrate

  • Laminated Materials & Processing, Materials for Packaging

  • Thermal Management

  • Reliability & Failure Mechanisms

  • Packaging for High-Speed Electrical Interconnect

  • Signal Integrity / Power Integrity

  • RF Components & Modules

  • Packaging for Automotive & Power Electronics

  • Additive Manufacturing, 3D Printed Electronics

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Important Date
  • Conference Date

    Nov 07

    2016

    to

    Nov 09

    2016

  • May 27 2016

    Abstract Submission Deadline

  • Jul 08 2016

    Draft Paper Acceptance Notification

  • Sep 09 2016

    Draft paper submission deadline

  • Nov 09 2016

    Registration deadline

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