“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology. Packaging is everywhere! The conference started in 1992 as “The VLSI Packaging Workshop in Japan” and was renamed to “ICSJ” in 2010. Topics include a variety of packaging technologies, ranging from VLSI and 3D packaging, optoelectronics, bio and healthcare. In 2015 the conference will emphasize two main topics: Optoelectronics and Bio-healthcare. Optoelectronics will include optical interconnect, Si Photonics, telecom/datacom, and LEDs. Bio-healthcare will cover bioelectronics, sensing, biomimetics, and wearable devices. Advanced topics of primary interest to the participants include Advanced Packaging, Thermal and Reliability, and RF and Electrical Interconnect. This year, ICSJ will have a special session on 3D Printing."
Nov 09
2015
Nov 11
2015
Registration deadline
2025-11-12 Japan Kyoto
2025 IEEE CPMT Symposium Japan2024-11-13 Japan Kyoto
2024 IEEE CPMT Symposium Japan (ICSJ)2022-11-09 Japan Kyoto
2022 IEEE CPMT Symposium Japan2021-11-10 Japan Kyoto
2021 10th IEEE CPMT Symposium Japan2018-11-19 Japan
2018 IEEE CPMT Symposium Japan2017-11-20 Japan Kyoto,Japan
2017 IEEE CPMT Symposium Japan2016-11-07 Japan Kyoto, Japan
2016 IEEE CPMT Symposium Japan2014-11-04 Japan
2014 IEEE CPMT Symposium Japan (ICSJ)2013-11-11 Japan
2013 IEEE CPMT Symposium Japan
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