Introduction
The organizing committee of SIITME 2013 kindly invites you to submit an abstract/paper to the 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Galati, the largest Romanian harbour on Danube, on October 24th–27th, 2013.
Call for paper
Submission Topics
TOPICS
A. Emerging Technologies & Trends in Advanced Packaging
B. Power Electronics and Microsystems Packaging
C. Assembly and Manufacturing Technology
D. Design of Electronic Circuits and Systems
E. Electronics Simulation & Modelling
F. Electron
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Important Date
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Conference Date
Oct 24
2013
toOct 27
2013
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Oct 27 2013
Registration deadline
Sponsored By
IEEE Hungary/Romania Joint Section CPMT Chapter
Contact Information
Previous Conferences
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2022-10-26 Romania Bucharest
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging -
2021-10-27
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging -
2018-10-25 Romania
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging -
2017-10-26 Romania
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging -
2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging -
2014-10-23 Romania
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging
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