The organising committee of SIITME 2017 kindly invites you to submit an abstract/paper to the 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific event will take place in Constanta, Romania on October 26th–29th, 2017.
Emerging Technologies & Trends in Advanced Packaging, Microsystems, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
Components, Assembling, and Manufacturing Technology
Design of Electronic Circuits and Systems
Electronics Simulation & Modelling
Electronics Applications: Optoelectronics, Advanced Communication, Automotive, Aerospace and Power Electronics
Applied Reliability
Challenges in Global Education
Papers meeting the quality criteria will be included in the IEEE Xplore Digital Library and Thomson-Reuters ISI-CPCI.
Abstracts and papers will be reviewed by the international Scientific Committee.
1. Each abstract will be reviewed on:
suitability for one of the topics of the conference
scientific content and level, and the relevance of presented results;
correspondence with the abstract template, English usage and grammar.
Authors of accepted abstracts will be invited to submit a full-length conference paper according to the conference paper template.
2. Papers meeting the following criteria will be published in the Conference Proceedings and will be available through IEEE Xplore:
the comments of the reviewers have been taken into consideration;
originality of the paper is given;
it corresponds with the paper template, English usage and grammar are correct,
signed IEEE copyright form has been submitted.
Oct 26
2017
Oct 29
2017
Abstract Submission Deadline
Abstract Notification of Acceptance
Final Paper Deadline
Registration deadline
2022-10-26 Romania Bucharest
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2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging2014-10-23 Romania
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging2013-10-24 Romania
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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