Photos
Important Date
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Conference Date
Oct 26
2017
toOct 29
2017
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Jul 01 2017
Abstract Submission Deadline
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Aug 01 2017
Abstract Notification of Acceptance
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Sep 01 2017
Final Paper Deadline
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Oct 29 2017
Registration deadline
Sponsored By
University of Bucharest, Romania
Contact Information
- Mihaela Hnatiuc
- mh******@yahoo.com
- si******@siitme.ro
- 004*********
Previous Conferences
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2022-10-26 Romania Bucharest
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging -
2021-10-27
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging -
2018-10-25 Romania
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging -
2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging -
2014-10-23 Romania
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging -
2013-10-24 Romania
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
