Introduction
The organising committee of SIITME 2018 kindly invites you to submit an abstract/paper to the 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME). The scientific and technical event event will take place in Iași, Romania on October 25th–28th, 2018.
Call for paper
Important date
TOPICS
A. Emerging Technologies & Trends in Advanced Packaging, MEMS, Heterointegration, Printed Electronics, Smart Textiles, Healthcare
B. Components, Assembling, and Manufacturing Technology
C. Integrated circuits and Embedded systems
D. Virtual prototyping and System validation
E. IoT, Communication, Aerospace, Robotics and Artificial Intelligence
F. Optoelectronics, Display technology, Smart Lighting
G. Smart Grid, Intelligent Transport Systems and Vehicle Electrification
H. Applied Reliability, Characterization and Testing, Failure Diagnostic
I. Challenges in Global Education
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Important Date
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Conference Date
Oct 25
2018
toOct 28
2018
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May 31 2018
Abstract Submission Deadline
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Jul 01 2018
Draft Paper Acceptance Notification
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Sep 20 2018
Draft paper submission deadline
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Sep 20 2018
Final Paper Deadline
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Oct 28 2018
Registration deadline
Contact Information
- Bogdan Mihailescu
- bo******@cetti.ro
Previous Conferences
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2022-10-26 Romania Bucharest
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging -
2021-10-27
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging -
2017-10-26 Romania
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging -
2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging -
2014-10-23 Romania
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging -
2013-10-24 Romania
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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