Program
Timezone：Asia/Beijing
Program Overview
Important Date
-
Conference Date
Oct 25
2018
toOct 28
2018
-
May 31 2018
Abstract Submission Deadline
-
Jul 01 2018
Draft Paper Acceptance Notification
-
Sep 20 2018
Draft paper submission deadline
-
Sep 20 2018
Final Paper Deadline
-
Oct 28 2018
Registration deadline
Contact Information
- Bogdan Mihailescu
- bo******@cetti.ro
Previous Conferences
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2022-10-26 Romania Bucharest
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging -
2021-10-27
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging -
2017-10-26 Romania
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging -
2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging -
2014-10-23 Romania
2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging -
2013-10-24 Romania
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
