2016 IEEE Asian Solid-State Circuits Conference (A-SSCC)

Analog Circuits & Systems: Amplifiers, comparators, switch capacitor circuits, continuous-time & discrete-time filters, voltage/current references; DCDC converters, power-control circuits; IF/baseband analog circuits, AGC/VGA; non-linear analog circuits.

Data Converters: Nyquist-rate and oversampling A/D, D/A converters, time-to-digital converters, and capacitance-to-digital converters; sub-circuits for data converters including sample-and-hold circuits, calibration circuits, etc.

Digital Circuits & Systems: Design, fabrication, and test of digital VLSI systems; high-speed low-power digital circuits, power-reduction and management methods for digital VLSI, ultra-low-voltage and sub-threshold logic design; leakage reduction techniques; clock distribution, I/O circuits, reconfigurable logic-array circuits; supply/substrate noise measurement and cancellation for digital VLSI, variation and fault-tolerant circuits.

4. SoC & Signal Processing Systems: System-on-chip(including 3D integration), microprocessors, network processors, baseband communication processing system & architectures, energy efficient signal-processing systems; multimedia and recognition processing systems; cryptographic and security-processing circuits and systems; bio-medical/neural signal processors and sensor network systems.

RF: Receivers/transmitters/transceivers for wireless systems; narrowband RF, ultra-wideband and millimeter-wave circuits; circuits and building-blocks including RF front-end, LNA, mixer, power amplifiers, VCOs, frequency synthesizers, RF filters, RF switches, power detectors, active antennas.

Wireline: Receivers/transmitters/transceivers for wireline systems; optical/electrical data links and backplane transceivers; power-line communication; clock generation circuits, PLL, DLL, spread-spectrum clock generation; building blocks for high-speed wireline communication; analog-digital mixedmode circuits.

Emerging Technologies and Applications: Advanced system designs and circuit solutions for technologies and applications including state-of-the-art devices and packaging technologies; flexible and printable electronics; smart sensors and transducers; MEMS for analog, RF, and sensor applications; image sensors and displays; energy harvesting systems; transceiver systems; medical/bio-electronics/bio-inspired chip design and silicon systems.

8. Memory: Volatile and Non-volatile memory; new memory designs for 3D/2D architectures, emerging devices such as resistive-/phase change- /magnetic-/ferro-electric- memory devices; data storage and multi-bit-cell memory design; cache-memory system, multi-port memory, and CAM design; yield-enhancing and ECC techniques; memory testing and built-in self-test