The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world, especially from Asia, to exchange innovative ideas on system, board, and device testing with design, manufacturing and field consideration in mind.
nalog/Mixed-Signal Test
Automatic Test Generation
Board Test and Diagnosis
Boundary Scan Test
Built-In Self-Test (BIST)
Defect-Based Test
Delay and Performance Test
Dependability and Functional Safety
Design for Test (DFT)
Diagnosis and Silicon Debug
Economic of Test
Failure Analysis
Fault Modeling and Simulation
Fault Tolerance
GPU Test
High-Speed I/O Test
Low-Power IC Test
Memory Test and Repair
MEMS Test
Multi-/Many-core Processor Test
Nanotechnology Test
On-line Test
Power/Thermal/Reliability Issues in Test
Reconfigurable System Test
Reliability
RF Test
Security and Trust Issues in Test
Self-Repair
Sensor Test
SiP, Stacked, 3D IC Test
SoC Test
Standards in Test
Statistical Learning in Test
Test Compression
Test Quality
Test Synthesis
Validation and Verification
Yield Analysis and Enhancement
Nov 27
2017
Nov 30
2017
Abstract Submission Deadline
Draft paper submission deadline
Draft Paper Acceptance Notification
Final Paper Deadline
Registration deadline
2024-12-17 India Ahmedabad
The 33rd IEEE Asian Test Symposium (ATS 2024)2023-10-14 China Beijing
2023 IEEE 32nd Asian Test Symposium2022-11-21 Taiwan, China Taichung City
2022 IEEE 31st Asian Test Symposium2018-10-15 China Hefei
2018 IEEE 27th Asian Test Symposium2016-11-21 Japan Hiroshima,Japan
2016 IEEE 25th Asian Test Symposium2013-11-18 Taiwan, China
2013 IEEE 22nd Asian Test Symposium
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