2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

The 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits ( IPFA 2017 ) is organized by the IEEE Reliability / CPMT / ED Singapore Chapter, IEEE Electron Devices Society Chengdu Chapter and the University of Electronic Science and Technology of China ( UESTC ) . The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

IPFA 2017 will be devoted to the fundamental understanding of the physical mechanisms governing failure in a large variety of advanced semeconductor devices and the electrical - physical failure analysis techniques, methodologies and tools that could be use to reliably identify the root cause of failure in these devices.