Introduction
The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) is Asia’s premier conference dedicated to IC failure analysis and reliability. 2018 marks its 25th edition and every year professionals, academic, suppliers, decision-makers, aspiring authors and world-class speakers congregate to share technology updates and address industry challenges. IPFA 2018 will feature an extensive program which includes:
Keynotes and Invited Talks
- Tutorials and Workshops
- Exhibition
- Exchange Paper in FA and Reliability
- Art of Failure Analysis Photo Contest
We cordially invite you to join us from the 16th-19th July at Marina Bay Sands, Singapore.
Call for paper
Important date
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Important Date
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Conference Date
Jul 16
2018
toJul 19
2018
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Feb 05 2018
Abstract Submission Deadline
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Mar 11 2018
Draft Paper Acceptance Notification
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Jul 19 2018
Registration deadline
Sponsored By
Contact Information
- Jasmine Leong
- ie******@singnet.com.sg
Previous Conferences
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2023-07-23 Malaysia Pulau Pinang
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2022-07-18 Singapore Singapore
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2021-09-15
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2017-07-04 China Chengdu
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2016-07-18 Singapore Singapore
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2013-07-15 China 苏州市
The 20th International Symposium on the Physical and Failure Analysis of Integrated Circuits
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