Introduction
The 20th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2013) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter, IEEE Nanjing Section ED/SSC Jiont Chapter, Soochow University, and Suzhou Institute of Electronics. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.
IPFA 2013 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies.
Call for paper
Submission Topics
The Technical Programme Committee is inviting papers related, but not limited to, the following areas:
Sample Preparation, Metrology and Material Characterization
Advanced Failure Analysis Techniques
Die-Level / Package-Level Failure Analysis Case Study
All Comments
Important Date
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Conference Date
Jul 15
2013
toJul 19
2013
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Jul 19 2013
Registration deadline
Sponsored By
IEEE Reliability/CPMT/ED Singapore Chapter, IEEE Nanjing Section ED/SSC Jiont Chapter, Soochow University, and Suzhou Institute of Electronics
Contact Information
- 李莹
- ip******@hhcore.com
- +86*********
Previous Conferences
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2023-07-23 Malaysia Pulau Pinang
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2022-07-18 Singapore Singapore
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2021-09-15
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2018-07-16 Singapore
2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2017-07-04 China Chengdu
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits -
2016-07-18 Singapore Singapore
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits
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