Introduction

The 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

 

IPFA 2016 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.

Call for paper

Important date

2016-02-05
Abstract submission deadline
2016-05-20
Draft paper submission deadline
2015-03-11
Draft paper acceptance notification
2016-05-20
Final paper submission deadline

The Technical Programme Committee is inviting papers related, but not limited to, the following areas:

  • Sample Preparation, Metrology and Defect Characterization
  • Die-Level/Package/System-Level Failure Analysis Case Studies
  • Advanced Fault Isolation Techniques
  • Advanced Physical Failure Analysis Techniques
  • Front-End of Line (FEOL) Reliability
  • Back-End of Line (BEOL) Reliability
  • Package-Level Reliability
  • Non-Volatile Memory (NVM) and Non-Silicon Device Reliability

Prospective authors are requested to submit one cover page and a two-page summary (includes text and figures) of their previously unpublished and original research work. Please refer the paper submission page for more information.

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Important Date

  • Conference Date

    Jul 18

    2016

    to

    Jul 21

    2016

  • Mar 11 2015

    Draft Paper Acceptance Notification

  • Feb 05 2016

    Abstract Submission Deadline

  • May 20 2016

    Draft paper submission deadline

  • May 20 2016

    Final Paper Deadline

  • Jul 21 2016

    Registration deadline

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IEEE
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