2018 IEEE International Reliability Physics Symposium (IRPS)

Circuits, Products, and Systems
Circuit Reliability – Includes digital, mixed-signal,
power and RF applications; design for reliability,
variability-aware design.
Circuit Aging Simulation – Includes compact
modeling; statistical methods
Product IC Reliability – Includes burn-in; defect
detection; on-chip sensors; modeling
Consumer Electronics Reliability – Includes smart
phones; wearable devices; tablets; healthcare devices
Electronic System Reliability – Includes automotive,
space, communications, medical, energy, and
photovoltaic applications; screening techniques;
reliability-aware circuit design and optimization, system
monitoring; failure root cause determination; modeling
methodologies, product qualification vs reliability.
Soft Errors – Includes neutron and alpha particle SER;
multi-bit SER/SEU; mitigation techniques; simulation
ESD and Latchup – Includes component and systemlevel
ESD design; modeling and simulation
3D Assembly – Includes multichip modules; 3D
integration with TSV; thermomechanical stress; wafer
thinning effects
Packaging – Includes chip-package interaction; fatigue;
power dissipation issues, Reliability 2.5D and 3D IC packaging and interconnects;

Devices, Processing, and Materials
Transistors – Includes hot carrier phenomena; biastemperature
instability; random telegraph noise; advanced
transistor scaling, variability, Ge and III-V channels
Gate Dielectrics – Includes TDDB modeling; reliability of
novel gate dielectrics; modeling of progressive breakdown;
gate dielectric reliability for III-V FETs
Beyond CMOS Devices – Includes reliability of tunnel
FETs, transistors with 2D semiconductors (graphene,
MoS2), Ferroelectric FETs, and spintronics
Compound/Optoelectronics – Includes reliability of wide
bandgap (GaN, SiC) power devices, optoelectronics, and
silicon photonics, Reliability of far infrared detectors
Back-End Reliability – Electromigration; Joule heating;
stress migration; low-k dielectric breakdown; middle-ofthe-line
reliability, MIM/MOM capacitors
Process Integration – Includes new process-related
reliability issues; foundry reliability challenges
Failure Analysis – Includes evidence of new failure
mechanisms; advances in failure analysis techniques
Memory – Includes DRAM and NVM; failure mechanisms
in novel memory devices including 3D Flash and ReRAM
Photovoltaics – Includes reliability of solar cell devices in
silicon, CdTe, CIGS, organics, multi-junctions, etc.
MEMS – Reliability of sensors and actuators; reliability
testing; analysis & modeling, BioMEMS