Introduction

IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

Sponsor Type:1; 1

Committee

General Chair

Robert Kaplar
Sandia

Vice General Chair

Charles Slayman
Cisco Systems

Technical Program Chair

Chris Connor
Intel

Finance Chair

Koji Eriguchi
Kyoto University

Arrangements Chair

Susumu Shuto
Toshiba

Audio Visual / Presentations Chair

Barry Linder
IBM

Communications Chair

Georgios Konstadinidis
Google

Publications  Chair

Marta Bagatin
University of Padova

Publicity Chair

Ben Kaczer
IMEC

Registration Chair

Tibor Grasser
TU Wien

Tutorials Chair

Jason Ryan
NIST

Workshops Chair

Christine Hau-Riege
Qualcomm

Exhibits Chair

Patick Justison
Global Foundries

Secretary

Shireen Warnock
MIT

Past General Chair and BOD Chair

Gaudenzio Meneghesso
University of Padova

Conference Manager

Lisa Boyd
IEEE MCE

Call for paper

Important date

2021-01-23
Draft paper submission deadline

Submission Topics

Circuit Reliability and Aging
IC Product Reliability
System Electronics Reliability
Soft Errors
ESD and Latchup
Packaging and 2.5D/3D Assembly
Reliability Testing
Silicon Photonics
RF/mmW/5G
Transistors
Gate/MOL/BEOL Dielectrics
Beyond CMOS Devices
Neuromorphic Computing Reliability
Gallium-Nitride and Silicon-Carbide Wide-Bandgap Semiconductors
Compound and Optoelectronic Devices
Metallization/BEOL Reliability
Process Integration
Failure Analysis
Memory Reliability
MEMS

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Important Date
  • Conference Date

    Mar 21

    2021

    to

    Mar 25

    2021

  • Jan 23 2021

    Draft paper submission deadline

  • Mar 25 2021

    Registration deadline

Sponsored By
IEEE Electron Devices Society IEEE Reliability Society