Introduction

For 54 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. 

 

IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world. We look forward to seeing you in Pasadena!

Call for paper

Submission Topics

YOUR ORIGINAL PAPERS AND POSTERS ARE SOLICITED, which:

  • Identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems;
  • Identify how fabrication processes influence the susceptibility of product to particular physical failure mechanisms;
  • Quantify the impact of device and circuit design, as well as material and process selection on reliability;
  • Present new, innovative, or improved failure analysis techniques;
  • Describe reliability testing/stressing, qualification, and screening methodologies or strategies for materials, devices, circuits, or chips; either at wafer- or module-level for commercial or environments;
  • Demonstrate techniques to build-in or extend reliability while meeting performance goals, especially as technologies are scaled.
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Important Date

  • Conference Date

    Apr 17

    2016

    to

    Apr 19

    2016

  • Apr 19 2016

    Registration deadline

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