Introduction

For 54 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment.

IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

Call for paper

Important date

2016-10-23
Draft paper submission deadline

Submission Topics

  • Gate Dielectrics

  • Back-End Reliability

  • Transistors

  • ESD and Latchup

  • Soft Errors

  • Memory

  • Product IC Reliability

  • Wide Band-Gap

  • Process Integration

  • Circuit Reliability

  • Circuit Aging Simulation

  • Consumer Electronics Reliability

  • Electronic System Reliability

  • 3D Assembly

  • Packaging

  • MEMS

  • Beyond CMOS Devices

  • Failure Analysis

  • Photovoltaic Devices

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Important Date
  • Conference Date

    Apr 02

    2017

    to

    Apr 06

    2017

  • Oct 23 2016

    Draft paper submission deadline

  • Apr 06 2017

    Registration deadline

Sponsored By
IEEE