2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Original papers are solicited in the following general areas of interest (but not limited to):

COMPONENT-LEVEL THERMAL MANAGEMENT

• Transistor Technology
• 2.5D / 3D Packaging
• Embedded Cooling
• Hotspot and Impingement Cooling
• Thermal Interface Materials and Heat Spreaders
• Thermoelectric and Peltier Devices
• Heat Pipes, Vapor Chambers and Thermosyphons
• Single / Two-phase Cold Plates and Heat Sinks
• RF and Power Electronics
• LEDs and Photovoltaics
• Pulsed Power Dissipation

SYSTEM-LEVEL THERMAL MANAGEMENT

• Air Cooling Techniques and Heat Exchangers
• Liquid Cooling Solutions
• Immersion Cooling and Refrigeration
• Pumps, Compressors, Fans and Blowers
• Phase Change Materials
• Automotive, Batteries and Thermal Storage
• Mobile and Internet of Things
• Telecommunication Systems
• Space and Aerospace
• Data Center Thermal Management

EMERGING TECHNOLOGIES & FUNDAMENTALS

• Convection in Microchannels, Microgaps & Jets
• Pulsating / Oscillating and Non-Conventional HeatPipes
• Thermal Transport in Nanotechnologies
• Novel Materials and Fabrication Techniques
• Measurement and Instrumentation Techniques
• Numerical Methods, Nano-to-Macro Scale
• Experimental Methods, Nano-to-Macro Scale
• Prognostic Health Management and Reliability Analysis
• Flexible Electronics
• Additive Manufacturing

MECHANICS & RELIABILITY

• Thermo-Mechanical Modeling and Simulation
• Mechanics and Reliability of Solder Joints and Interconnects
• Materials Characterization, Processing, and Constitutive Models
• Failure Mechanics, Fatigue, and Damage Modeling
• Measurement of Deformations, Strains and Stresses
• Shock, Drop and Vibrational Analysis
• TSV / 3D Reliability and Packaging
• Mechanics in Assembly and Manufacturing
• Applied Reliability andFailure Analysis
• Process-Structure-Property Relations / Multi-Scale Analyses
• Accelerated Stress Testing and Modeling
• Lifetime Prognostics and Condition Monitoring