Introduction
Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2022 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITherm 2022 will be held along with the 72nd Electronic Components and Technology Conference (ECTC 2022 - http://www.ectc.net), a premier electronics packaging conference at the Sheraton Hotel & Marina, San Diego, CA, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2022 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.
All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.
Sponsor Type:1
Call for paper
Important date
Originality and significance of the work
Quality of data/results and interpretation
Completeness of the manuscript
Non-commercial nature of the manuscript
References to the work of others
Literary quality (clarity in writing, organization, figures, tables, etc.)
Good use of technical/written English is expected. In cases where sentence structure, grammar, and understandability are not adequate, the technical program committee may require a strong copy-edit by you or your institution as a condition for acceptance of the final paper.
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Important Date
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Conference Date
May 27
2031
toMay 30
2031
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Sep 20 2030
Abstract Submission Deadline
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May 30 2031
Registration deadline
Sponsored By
Contact Information
Previous Conferences
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2028-05-30 United States Dallas
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2021-06-01 United States San Diego
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2020-05-26 United States Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2019-05-29 United States
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2018-05-29 United States
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2017-05-30 United States Orlando
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2016-05-31 United States Las Vegas, USA
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2014-05-27 United States
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
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